California-based semiconductor startup Frore Systems hit the headlines recently, by raising a USD 143 million Series D, led by MVP Ventures, at a USD 1.64 billion valuation. The venture now has funding worth USD 340 million in total.
However, the catch is that Frore doesn’t make the chips themselves; the start-up’s speciality lies in creating liquid-cooling systems for these cutting-edge products. Founded by two former Qualcomm engineers, Dr. Seshu Madhavapeddy and Dr. Surya P. Ganti, the company started by offering air-cooling tech for phones and other small fanless electronics.
Frore Systems, which focuses on creating liquid-cooling systems for semiconductors, gained a new purpose a couple of years ago, after demonstrating the product to the NVIDIA CEO Jensen Huang. He suggested the start-up develop the technology further, envisioning it becoming the new normal for AI chips and systems in the coming years.
As of 2026, Frore Systems’ products work with various NVIDIA chips and boards. The company has also developed products for Qualcomm and AMD.
Making ‘AI Thermal Stack’ As Key Forte
According to Frore Systems, the new funding will accelerate the global scale-up of the start-up’s breakthrough thermal platforms, LiquidJet, LiquidJet Nexus and AirJet, across data centre and edge markets, as demand for AI infrastructure continues to grow globally.
Discussing Frore Systems’ key products, we find the start-up’s breakthrough innovation named the “LiquidJet Coldplate,” with features like multistage cooling architecture, 3D hybrid cells, and first-of-its-kind 3D short-loop jetchannel microstructures, all of which make the tool customisable to any GPU power map. Explaining the product, the venture remarked, “LiquidJet is engineered to scale with next-gen GPUs like NVIDIA Rubin, Rubin Ultra, Feynman and beyond, as well as for custom hyperscaler ASIC designs. As AI workloads explode, Frore Systems’ LiquidJet architecture is built to keep up.”
LiquidJet’s revolutionary direct-to-chip liquid cooling 3D coldplate solution has been tailored to meet the escalating demands of AI Data Centres, by unlocking higher performance from the world’s most powerful GPUs, starting with NVIDIA Blackwell Ultra. This delivers significant reductions in data centre total cost of ownership (TCO) and improves power usage effectiveness (PUE).
LiquidJet’s innovative multistage architecture concentrates the entire cooling flow around the chip’s hotspots. This contrasts with legacy coldplates, which rely on 2D flow through skived microchannels, limiting their ability to adapt to new chip layouts and increasingly non-uniform high power density requirements.
Frore Systems, while implementing its liquid cooling 3D coldplate solution, adapts semiconductor manufacturing with metal wafers. The next stage involves fabricating multistage cooling architecture, 3D hybrid cell structures, and innovative 3D short-loop jetchannel microstructures that are designed precisely to the power maps of modern GPUs.
Also, “LiquidJet Nexus,” an integrated lightweight coldplate system for “½U Compute Trays,” is designed to unlock the full performance of AI compute platforms.
“LiquidJet Nexus consists of multiple multistage 3D short loop jetchannel LiquidJet coldplates. Unlike traditional compute tray level coldplate implementations, which rely on multiple hoses, connectors, and manifolds, LiquidJet Nexus integrates the entire compute tray thermal stack into a tightly engineered platform, delivering a lighter, cleaner, and more efficient solution that enables 2x compute density, simplifies integration, and improves reliability across AI data centre deployments,” Frore Systems described the product.
LiquidJet Nexus incorporates the performance gains of LiquidJet coldplates, while reducing thermal stack complexity by eliminating all compute tray hoses, connectors and manifolds, halving the weight in the process. Apart from improving rack-level performance by over two times with reduced total cost of operation for data centres, LiquidJet Nexus has redefined the data centre thermal stack design into a strategic performance advantage for next-generation AI compute platforms.
Excelling In Solid-state Active Air Cooling As Well
Frore Systems’ “AirJet Mini Slim Chip,” built on the same revolutionary active cooling design as the “AirJet Mini,” is the world’s first solid-state active cooling chip. AirJet Mini Slim removes 5.25 Watts of heat at a silent 21 dBA noise level, while only consuming a maximum of 1 Watt of power. It also generates 1750 Pascals of back pressure, enabling sleek, dustproof devices. The tool has also created a separate place for itself in the AI industry, by reportedly becoming the thinnest and most advanced solid-state active cooling chip available, while remaining silent, lightweight and delivering superior performance over traditional fans.
Next, we have “AirJet Mini G2,” a thermal solution tailor-made for the current generation AI models. The world’s thinnest and most powerful solid-state active cooling chip. AirJet is a revolutionary, fully self-contained active heat sink module that removes 7.5W of heat, in addition to being silent, thin, light, dust-resilient, vibration-free, water-resistant and outperforming fans.
AirJet’s multiphysics design converges structural, fluidic, acoustic and electrical resonance. The product’s manufacturing process also involves the use of proprietary techniques that draw from multiple sectors, including semiconductor, flat panel display, aerospace and automotive.
“In modern computing, heat limits performance — not the capability of the processor. AirJet Mini G2 flips that equation, ensuring compact electronic devices can now deliver on the promise of full performance. It generates 1750 Pascals of backpressure — powerful enough to pull air through the most compact enclosures, even in rugged embedded systems,” Frore Systems noted.
Meet AirJet PAK
We are talking about Frore Systems’ other “Plug and Play Solid-State Active Cooling” solution, which, by accelerating the performance of Edge AI, is transforming industries like transportation and logistics, industrial manufacturing, smart retail, smart city, healthcare and agriculture.
Explaining the tool, the start-up said, “AirJet PAK is a fully self-contained, plug-and-play thermal solution that includes multiple AirJet chips and drive circuitry. It mounts directly on AI SoM Modules like NVIDIA’s Jetson Orin, Qualcomm’s Snapdragon and DragonWing, and AMD’s Versal and Kria.”
AirJet PAK integrates multiple AirJets to remove the increasing heat generated by intense AI workloads. This unleashes the AI performance needed for Edge AI. The product is also a fully integrated, self-contained, plug-and-play active cooling solution, as thin as 6.5mm, making it easily addable to a host device.
This is a breakthrough innovation, given the fact that the need for improved cooling to enable AI is increasing rapidly, as the demand forecast sees Edge AI-based computing likely increasing by over 300% by 2030. It is the factor called “heat,” that limits the technology’s performance. However, with AirJet’s introduction, AI applications will get a new lease of life.
“Driven autonomously, the AirJet PAK can independently sense the surrounding temperature using Thermoception, an innovation that allows the AirJet PAK to optimise its performance, maximising heat removal without relying on temperature sensors in the host device. All the AirJet PAK needs to enable exceptional processor performance is a nominal power source from the host device,” Frore Systems concluded.